Ex parte SHIH et al. - Page 10




          Appeal No. 95-2011                                                          
          Application No. 07/959,011                                                  


               The examiner’s position is not without merit.  However, a              
          close examination of Skeist reveals that there is no                        
          suggestion to use a core-shell polymer of the type disclosed                
          in Shih as a contact adhesive.  We agree with appellants that               
          "neither reference discloses or suggests the particular                     
          composition as claimed could be a contact adhesive" (Brief, p.              
          4).  Therefore, there would have been no reason to add a                    
          tackifier to the adhesive disclosed in Shih.                                
               In addition, Shih discloses that heat may be used to bond              
          the laminating adhesives to film substrates (col. 13, lines                 
          19-33):                                                                     
               [T]he adhesive is coated on a film and allowed to                      
               dry at room temperature (or dried at moderate heat).                   
               The adhesive coated film is then laminated to the                      
               desired substrate, for example, a corona treated                       
               polyethylene or polypropylene film or other lamina                     
               by passing through a "hot nip" roller.  The                            
               resultant laminate is characterized by the immediate                   
               formation of a strong bond which gains strength on                     
               room temperature (R.T.) as a result of polymeric                       
               hardening and curing.                                                  

               According to Skeist (p. 443, col. 2):                                  
               Heat and Pressure Bonding                                              
               With heat-activated bonding techniques, a non-blocking                 
               (tack-free) film is applied to one substrate and later                 
               reactivated by the application of heat, which produces                 
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