Ex parte ANDERSON et al. - Page 6




          Appeal No. 95-2413                                                          
          Application 07/936,865                                                      

          l-a, which can occur at any arbitrary angle 2  (which can be                
                                                       0                              
          considered the zero angle in a new coordinate system):                      
          r = b2  = l-a, at 2 = 2 .  The greatest radius, l+a, occurs at0           0                                                         
          2 = 2 +B:  r = b(2 +B) = b2 +bB = l-a + bB = l+a, at 2 = 2 +B.0           0       0                      0                       
          So b = 2a/B.  Therefore, r = l-a + 2a*2*/B, for -B # 2 # B.                 
          The centers of the magnets gaps are aligned along the curve                 
          and, so, the width of the closed-loop path appears to be                    
          constant.                                                                   
                    Sato '374                                                         
               Sato '374 discloses the same heart-shaped curve based on               
          a spiral as Sato '375, which is said to provide equal target                
          sputtering (translation, page 7).  Sato '374 provides no                    
          additional information to Sato '375.                                        
                    Suzuki                                                            
               Suzuki is the U.S. equivalent of European Patent                       
          Publication No. 211,412, published February 25, 1987, noted at              
          page 2, lines 17-20, of the specification (Information                      
          Disclosure Statement, Paper No. 5).  Suzuki discloses a planar              
          magnetron sputtering source in which the magnets are arranged               
          "to make an erosion of the target surface uniform and also to               
          deposit the sputtering material uniformly on a substrate"                   

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