Ex parte INOUE et al. - Page 13




          Appeal No. 1998-0970                                                        
          Application 07/995,325                                                      

          teaches away from high temperatures because they can cause                  
          breakdown of the radical group leading to undesirable products              
          of combustion and contamination of the semiconductor surface.               
          The Examiner's reasoning that it would have been "within the                
          scope of the art to employ the recited temperature range when               
          appropriate" (EA4) fails to deal with these contrary teachings              
          of Griswold and fails to provide any reason for using a high                
          temperature range not disclosed in Griswold.  Thus, the                     
          Examiner fails to establish a prima facie case of obviousness.              
          Gong discloses depositing a layer of amorphous silicon, a                   
          layer of Sb, and a layer of amorphous silicon followed by                   
          annealing.  While Gong may disclose putting down a layer of                 
          silicon before a layer of impurity material, which is relevant              
          to claim 15, step h), it does not disclose the temperature                  
          during deposition of the impurity component and, so, does not               
          cure the deficiency of Tsunashima, Nickl, Allman, and Griswold              
          with respect to the step of depositing an impurity component                








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