Appeal No. 1999-0139
Application No. 08/542,576
having specified properties. Claim 1 is illustrative:
1. A fabrication process of a semiconductor
package, comprising the steps of:
(1) bonding a semiconductor chip to a lead frame
with an adhesive member; and
(2) molding a molding compound so that the
molding compound covers at least said semiconductor
chip and a bonded part between the semiconductor
chip and said lead frame, wherein:
said adhesive member is a composite
adhesive sheet comprising a heat-resistant film
and a coating layer of an adhesive applied on
both major surfaces of the heat resistant film;
and
said adhesive is a heat-resistant adhesive
having a coming-out length of not more than 2
mm and a water absorption rate of not more than
3 wt.%.[1]
THE REFERENCES
Newman et al. (Newman) 4,545,840 Oct. 08,
1985
Pashby et al. (Pashby) 4,862,245 Aug. 29,
The appellants define “coming-out length” as “the length of a came-out1
peripheral portion of a 19 x 50 mm wide adhesive film of 25 Fm in thickness as
measured at a central part in the direction of the longer surfaces of the
adhesive film when the adhesive film is pressed at 350ºC under 3 MPa for one
minute” (specification, page 8, lines 7-11).
2
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