Appeal No. 1999-0139
Application No. 08/542,576
between the semiconductor chip and the lead frame (col. 3,
lines 59-65; col. 4, lines 6-33). Pashby does not disclose
the coming-out length or the water absorption rate of the
adhesive.
The examiner argues that the adhesive in the processes of
both Pashby (col. 4, lines 17 and 21) and the appellants
(specification, page 7, line 19) can be a polyimide adhesive,
and that because both adhesives are polyimide adhesives, they
must have the same coming-out length and water absorption rate
(answer, page 5).
The appellants argue that the coming-out length and the
water absorption rate required by their claims are not
inherent characteristics of polyimide adhesives (brief, pages
4-6). The appellants argue that their specification teaches
(page 9, lines 5-16; page 18, line 23 - page 19, line 16) that
the coming-out length and the water absorption rate depend
upon the ratio of reaction components used to make the
adhesive resin and upon additional factors such as the
reaction conditions used in making the adhesive resin, the
adhesive resin molecular weight, and the presence in the
adhesive composition of additional resins such as epoxy resins
4
Page: Previous 1 2 3 4 5 6 7 8 Next
Last modified: November 3, 2007