Appeal No. 1999-0139
Application No. 08/542,576
1989
THE REJECTIONS
Claims 1-12 stand rejected as follows: under 35 U.S.C.
§ 102(b) as anticipated by or, in the alternative under 35
U.S.C. § 103 as obvious over Pashby, and under 35 U.S.C. § 103
as obvious over Pashby in view of Newman.
OPINION
We reverse the aforementioned rejections.
Rejection under 35 U.S.C. § 102(b)
In order for a claimed invention to be anticipated under
35 U.S.C. § 102(b), all of the elements of the claim must be
found in one reference. See Scripps Clinic & Research Found.
v. Genentech Inc., 927 F.2d 1565, 1576, 18 USPQ2d 1001, 1010
(Fed. Cir. 1991).
Pashby discloses a method for making a semiconductor
package wherein a semiconductor chip is bonded to a lead frame
by an adhesive member comprised of a heat resistant film
having an adhesive coating on both of its sides, and a molding
compound covers the semiconductor chip and a bonded part
3
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