Appeal No. 1999-1463
Application 08/467,052
mounting region would be "substantially" equal to that of the bottom surface of the Peltier
element TEC when the showings in Figures 1, 2, 6 and 7 are taken in combination. We
also agree with the examiner’s view that the entire periphery of the Peltier effect element
TEC in the noted figures of Kluitmans would be raised with respect to the metal casing.
On the other hand, claim 1 recites a functional feature "such that extra solder
squeezed out from under the Peltier effect device during the soldering will flow away from
the Peltier effect device instead of up onto the device." Both the statement of the rejection
portion and the responsive arguments portion of the answer has not addressed this
functional feature. Corresponding arguments of appellant at page 12 of the principal brief
and page A3 of the reply brief persuade us that the requirements of this quoted clause
would not have been met by the combination of teachings and suggestions of Kluitmans
and Herbst. The region of the Peltier effect device TEC near the vertical portion of the L-
shaped cooling plate CP in the various figures of Kluitmans would have caused any solder
that may have been squeezed out from under the Peltier effect device during the soldering
operation, as quoted above, to congregate in that end region and tend to flow upwardly
onto the top surface of the lower portion P of the Peltier device TEC. The solder in this
1
region or end portion of the Peltier device TEC would well up or wick up because of its
4
Page: Previous 1 2 3 4 5 6 7 Next
Last modified: November 3, 2007