Appeal No. 1999-1463
Application 08/467,052
inherent surface tension and would not appear to us to flow downwardly into what may be
seen as a groove-shaped side region below the bottom portion of the cooling plate CP,
such as illustrated in the end view of Figure 7. Thus, the solder would not tend to flow away
from the Peltier effect device around the entire periphery of the region as required by claim
1 as a whole according to the combination of teachings of the references relied upon by
the examiner.
Because we reverse the rejection of claims 1, 3 and 4, we must also reverse the
additional rejection of claim 2 even if we consider the additional teachings of Greve
because this latter reference does not cure the deficiencies noted above with respect to
the combination of Kluitmans and Herbst.
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