Appeal No. 2001-1448
Application No. 09/121,036
As noted on page 1 of the specification, appellant's
invention relates to a semiconductor chip package having a clip-
type lead frame and the method of fabrication thereof. More
particularly, the invention before us on appeal is limited to the
method of fabricating a chip package. A copy of representative
independent claims 12 and 21 can be found in the Appendix to
appellant's brief.
The prior art references of record relied upon by the
examiner in rejecting the appealed claims are:
Kikuchi et al. (Kikuchi) 5,084,694 Jan. 28, 1992
Song 5,554,886 Sep. 10, 1996
Kim et al. (Kim) 5,625,221 Apr. 29, 1997
Claims 12 through 17 and 20 stand rejected under 35 U.S.C.
§ 103(a) as being unpatentable over Song in view of Kikuchi.
Claims 18, 19 and 21 through 25 stand rejected under
35 U.S.C. § 103(a) as being unpatentable over Song in view of
Kikuchi and further in view of Kim.
Rather than reiterate the examiner's specific comments
regarding the above-noted rejections and the conflicting
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