Appeal No. 2001-1448
Application No. 09/121,036
particular problem in the manufacture of chip packages addressed
by appellant (specification, pages 2-3).
However, even if one were to consider the collective
teachings of Song and Kikuchi, we agree with appellant's
assessment on pages 6-9 of the brief and in the reply brief that
a person of ordinary skill in the art would have found no reason,
suggestion or incentive for attempting to combine those
references so as to arrive at appellant's claimed subject matter.
Simply stated, one of ordinary skill in the art would have found
no reason to attempt to modify the bendable lead frame used in
the semiconductor chip package of Song (Figs. 3A-10) in light of
the flow detection element of Kikuchi and its continuous layer of
electrically conductive thick film (3) connecting the cylindrical
resistor (2) therein with the lead wires (5).
In that regard, we note, as our court of review indicated in
In re Fritch, 972 F.2d 1260, 1266, 23 USPQ2d 1780, 1784 (Fed.
Cir. 1992), that it is impermissible to use the claimed invention
as an instruction manual or "template" in attempting to piece
together isolated disclosures and teachings of the prior art so
that the claimed invention is rendered obvious. Moreover, and
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