Appeal No. 2001-1448
Application No. 09/121,036
examiner that Song discloses outer portions of the leads therein
which "cover" top, side and bottom surface portions of the chip
package, as broadly set forth in claim 21 on appeal, we find
nothing in the teachings of the applied references which is
suggestive of the step of "attaching a chip having a plurality of
bond pads to a first surface of the heat sink," as required in
appellant's claims 18 and 21, nor any rationale on the examiner's
part as to why this particular step would otherwise have been
obvious. Appellant made this specific argument in the paragraph
bridging pages 13 and 14 of the brief, and the examiner has
utterly failed to provide any response thereto.
While we would agree with the examiner that it would have
been obvious to one of ordinary skill in the art based on the
teachings of Kim to provide the chip package of Song with a heat
sink mounted on the central portion of the package body (40)
therein, as generally seen in Figure 12 of Kim (heat sink 121),
we share appellant's view that the applied references do not
disclose, teach or suggest the step of "attaching a chip . . . to
a first surface of the heat sink," as required in appellant's
claims 18 and 21 on appeal.
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