Appeal No. 1998-1681 Page 7
Application No. 08/523,075
removal.” Also the examiner refers to page 304 of that book,
wherein Elliott describes methods for detecting residual
monolayers of resist residues left on wafers after stripping.
Miura describes a method for inspecting photoresist film
on a wafer wherein patterned photoresist is exposed and
subsequently removed with a developer. Next, any gel
decomposed material left on the wafer is detected by using a
laser beam to irradiate the wafer. The presence of any gel
decomposed material is determined by detecting scattered light
resulting therefrom. See the fifth page of the English
translation of record.
Nakai describes a method for determining defects or dust
on a surface using sensors for detecting scattered light.
Muller is concerned with microminiature electrical motors and
their fabrication using thin-film materials as protectants
during etching. Lewis describes a positive photoresist
developer composition.
The examiner principally relies on Elliott, Miura and
Nakai (answer, page 5) in taking the position that an3
3The examiner has not shown how Lewis and the separately
applied Muller make up for the deficiencies of Elliott, Nakai
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