Ex Parte HUH et al - Page 2



          Appeal No. 1999-1674                                                        
          Application No. 08/923,949                                                  

               Claims 1 and 15 are representative of the subject matter on            
          appeal and read as follows:                                                 
                    1.  A semiconductor wafer cleaning apparatus                      
               comprising:                                                            
               an outer tank;                                                         
               a cleaning tank provided within said outer tank;                       
               a wafer carrier provided within said cleaning tank;                    
               a plurality of jet nozzles directed toward said wafer                  
               carrier, each of said plurality of jet nozzles including a             
               plurality of jet nozzle holes formed lengthwise                        
               therethrough, wherein a first of the plurality of jet                  
               nozzles is located at a bottom center of the cleaning tank             
               with the plurality of jet nozzle holes facing upward and a             
               second of the plurality of jet nozzles is located at both              
               sides of the cleaning tank with the plurality of jet nozzle            
               holes facing a center of the wafer carrier at an oblique               
               angle;                                                                 
                    a main pipe connected to said jet nozzles;                        
                    a circulating pump connected to said main pipe and said           
               outer tank for circulating a cleansing solution from said              
               outer tank, through said main pipe, said jet nozzles, and              
               said cleaning tank, and back to said outer tank, the                   
               cleansing solution being directly sprayed from said jet                
               nozzles onto left, right, and bottom sides of the wafer; and           
                    a filter for filtering said circulated cleansing                  
               solution.                                                              





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