Appeal No. 2002-0981
Application 09/005,895
Claims 1, 12 and 18
Each of the appellant’s claims 1, 12 and 18 requires a
thermally curable material that includes a conductive adhesive.
MacKay discloses a method for forming a thermally curable
material on a support structure in an electronic device,
comprising placing the electronic device support structure
(substrate 5) on a heatable structure (heater stage 20),
depositing through a screen (stencil 40) a thermally curable
material (solder paste 70) onto a surface of the support
structure, and heating the heatable surface to heat the support
structure to a temperature sufficient to cure the thermally
curable material to bond the thermally curable material to the
support structure (col. 3, lines 52-60; col. 5, lines 4-8).1,2
MacKay does not disclose a thermally curable material including a
conductive adhesive.
1 The appellants state that “[a]s used in this application,
thermal curing includes both chemical or physical alteration of
the curable material, including altering the chemical
characteristics of an adhesive material or reflowing solder”
(specification, page 7, lines 27-30).
2 It is undisputed that MacKay’s process steps take place in
a process chamber.
4
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