Appeal No. 2002-0981
Application 09/005,895
Wood’s conductive adhesive cures at a temperature as low as 100ēC
(col. 7, lines 18-19), which is below MacKay’s exemplified 183ēC
solder melting temperature (col. 5, line 47), it reasonably
appears that MacKay’s system is capable of curing solder
containing at least a trace amount of conductive adhesive.
The appellant argues with respect to claim 25 that “MacKay
does not disclose a conductive adhesive as the thermally curable
material” (brief, page 8). What claim 25 recites is “a thermally
curable material including a conductive adhesive”. The claim
does not require a conductive adhesive as the thermally curable
material. Regardless, as discussed above, the system claimed in
claim 25 does not include the thermally curable material.
Accordingly, we affirm the rejections of claim 25 and
claims 30, 41 and 42 that stand or fall therewith.
DECISION
The rejections under 35 U.S.C. § 103 of claims 1, 3, 5, 12,
13 and 16-20 over MacKay in view of Zhou and Wood, claims 2
and 21 over MacKay in view of Zhou, Wood and Pennisi, and
claims 35-40 over MacKay in view of Zhou, Wood and Dery, are
reversed. The rejections under 35 U.S.C. § 103 of claims 25
and 30 over MacKay in view of Zhou and Wood, and claims 41 and 42
over MacKay in view of Zhou, Wood and Dery, are affirmed.
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