Ex Parte Agarwala et al - Page 4


             Appeal No. 2006-1663                                                                                
             Application No. 09/871,883                                                                          

                          surface and the outer surface of said upper edge of said lower                         
                          conductive liner in liner-to-liner contact regions.                                    
                   25.  An interconnect structure, comprising:                                                   
                                 a lower level wire in a dielectric layer, said lower level wire                 
                          having a side and a bottom and one or more integral extensions each                    
                          extension having a side and a bottom and extending laterally from the                  
                          side of said lower level wire, said lower level wire and extensions                    
                          comprising a lower core conductor and an lower conductive liner, said                  
                          lower conductive liner on the side and the bottom of said lower level                  
                          wire and said extensions, said lower conductive liner having an upper                  
                          edge having an inner surface, an outer surface, and a top surface, the                 
                          top surface of said upper edge substantially coplanar with a top                       
                          surface of said dielectric layer;                                                      
                                 an upper level wire having a side and a bottom and an array of                  
                          vias integrally formed in the bottom of said upper level wire, each via                
                          of said array of vias having a side and a bottom, said upper level wire                
                          and each via comprising an upper core conductor and an upper                           
                          conductive liner, said upper conductive liner on the side and the                      
                          bottom of said upper level wire and on the side and bottom of each                     
                          via, at least a portion of the bottom each via extending below a top                   
                          surface of said extensions of said lower wire level; and                               
                                 said upper conductive liner on the bottom of each said via of a                 
                          first portion of said array of vias in contact with said lower core                    
                          conductor of said lower level wire and a second portion of said array                  
                          of vias in contact with said lower core conductor of said extensions                   
                          and also in contact with both the inner surface and the outer surface of               
                          said upper edge of said lower conductive liner of said extensions in                   
                          liner-to-liner contact regions.                                                        
                   30.  An interconnect structure, comprising:                                                   
                                 a lower level wire having a side and a bottom, said lower level                 
                          wire comprising a lower core conductor and a lower conductive liner,                   
                          said lower conductive liner on the side and the bottom of said lower                   
                          level wire;                                                                            


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