Appeal No. 2006-1663
Application No. 09/871,883
one or more dielectric pillars formed in said lower level wire,
said lower conductive liner on sides of said dielectric pillars;
an upper level wire having a side and a bottom; said upper level
wire comprising an upper core conductor and an upper conductive
liner, said upper conductive liner on the side and the bottom of said
upper level wire; and
said upper conductive liner in contact with said lower core
conductor and also in contact with said lower conductive liner on the
sides of said dielectric pillars in liner-to-liner contact regions.
31. An interconnect structure, comprising:
a lower level wire having a side and a bottom, said lower level
wire comprising a lower core conductor and an lower conductive
liner, said lower conductive liner on the side and the bottom of said
lower level wire;
one or more dielectric pillars formed in said lower level wire,
said lower conductive liner on sides of said dielectric pillars;
an upper level wire having a side and a bottom and one or more
vias integrally formed in the bottom of said upper level wire, each via
having a side and a bottom, said upper level wire and each via
comprising an upper core conductor and an upper conductive liner,
said upper conductive liner on the side and the bottom of said upper
level wire and on the side and bottom of each via; and
said upper conductive liner on the bottom of at least a portion
of said one or more vias in contact with said lower core conductor and
at least a portion of said one or more vias in contact with said lower
conductive liner on said side of a least a portion of said one or more
dielectric pillars in liner-to-liner contact regions.
The references set forth below are relied upon by the Examiner as evidence
of obviousness:
Havemann US 6,156,651 Dec. 5, 2000
Otsuka US 6,373,136 Apr. 16, 2002
Farrar US 6,376,370 Apr. 23, 2002
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