Appeal 2007-2501
Application 10/026,917
1 2. The Examiner finally rejected independent claim 1 and
2 independent claim 11, the only independent claims, as being anticipated by
3 Hwang.
4 3. Claim 1 is as follows:
5 1. A method of manipulating semiconductor substrates comprising
6 placing a semiconductor substrate on a transportable electrostatic
7 chuck, and keeping the semiconductor substrate clamped on the
8 electrostatic chuck for the duration of and between at least two
9 processing steps of the semiconductor substrate without any additional
10 external power supply to recharge the transportable electrostatic chuck
11 during long or several process steps or operation steps.
12
13 4. Claim 11 is as follows:
14 11. An electrostatic carrier system for manipulating semiconductor
15 substrates, the system comprising at least one transportable
16 electrostatic chuck for a semiconductor substrate and at least one
17 transfer station for transferring the transportable electrostatic chuck
18 with the semiconductor substrate placed thereon between processing
19 steps, the electrostatic chuck being configured so as to clamp the
20 substrate without any additional external power supply to recharge the
21 transportable electrostatic chuck during long or several process or
22 operation steps.
23
24
4
Page: Previous 1 2 3 4 5 6 7 8 Next
Last modified: September 9, 2013