Appeal No. 1997-3390
Application No. 08/354,384
of Merz with Santangelo’s semiconductor substrate in view of
the different substrate materials or the preparation steps as
suggested by Merz. In particular, Merz in column 2, lines
42 through 47, specifies the feed powder as an alloy of
stainless steel and a refractory metal. Additionally, in
column 3, lines 62 through 65, Merz provides the preferred
blasting step that roughens and improves the surface adhesion
of a metal substrate such as steel and copper but does little
for a semiconductor substrate other than damaging its surface.
Neither the specific feed powder material nor the surface
preparation step would teach to one of ordinary skill in the
art to combine the processing steps of Merz with a
semiconductor substrate. We do not agree with the Examiner
that any substrate may simply be used for flame spraying as
Merz in column 3, lines 53 through 62, teaches that "[a]ny
suitable substrate" is preferably "metallic" or materials such
as "copper and steel." Merz further provides examples of
industrial grade steel that require different surface
treatment and coating process than a semiconductor substrate
as recited in Appellants’ independent claim 8.
9
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