Ex parte LEEDY - Page 10




          Appeal No. 1998-2422                                                        
          Application 08/488,380                                                      

               Appellant argues that the suitability of Keogh for                     
          alignment of PCB layers does not make that system suitable for              
          lithography tool alignment in semiconductor manufacture                     
          because the alignment tolerances required for semiconductor                 
          manufacture are at least two orders of magnitude smaller than               
          for multi-layer PCB fabrication (Br4).                                      
               The Examiner does not respond to this argument.                        
          Nevertheless, we are not persuaded by the argument because                  
          Appellant provides no reason why one of ordinary skill in the               
          art would not have considered it obvious to scale the coils in              
          Keogh down to the appropriate size for positioning of a                     
          lithography tool.  Since there is no difference between the                 
          coils and detection system of Keogh and the claimed invention               
          other than the size needed for the appropriate positioning                  
          accuracy, we do not see how the teachings of Keogh can be                   
          considered inappropriate for a lithographic positioning tool.               
               Appellant argues that because small coils are required                 
          for semiconductor manufacture, the lithographic tool must be                
          in intimate contact with the wafer and the coils on the wafer,              
          and that conventional prior art lithographic tools require                  
          high vacuum pressure to achieve intimate contact which does                 

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