Ex Parte CHEN et al - Page 8



          Appeal No. 1998-2671                                                        
          Application No. 08/480,543                                                  

          would exist only at the interface between the aluminum and the              
          silicide layer which occurs only at the upper portion of the via            
          hole.  Any conclusion drawn by the Examiner that a formed                   
          aluminum-silicide alloy would migrate from the upper interface              
          portion of the via hole to fill the hole cannot be based on the             
          disclosure of Mintz but, rather, only on unwarranted speculation.           
          In order for us to sustain the Examiner’s rejection under 35                
          U.S.C. § 102(b), we would need to resort to speculation or                  
          unfounded assumptions to supply deficiencies in the factual basis           
          of the rejection before us.  In re Warner, 379 F.2d 1011, 1017,             
          154 USPQ 173, 178 (CCPA 1967), cert. denied, 389 U.S. 1057                  
          (1968), rehearing denied, 390 U.S. 1000 (1968).  Accordingly,               
          since all of the claim limitations are not present in the                   
          disclosure of Mintz, the Examiner’s 35 U.S.C. § 102(b) rejection            
          of independent claim 10, as well as claims 11-13, and 18                    
          dependent thereon, is not sustained.                                        
                    The rejection of claims 3, 9-11, 13, and 18 under                 
                    35 U.S.C. § 103 as being unpatentable over Schilling              
                    in view of Tracy.                                                 
               As the basis for this obviousness rejection of                         
          representative independent claim 10, the Examiner proposes to               
          modify the integrated circuit structure disclosure of Schilling             
          which describes, particularly illustrated in Figure 1b, the                 
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