Appeal No. 2001-0130
Application No. 09/050,491
receiving metal is securely bonded to a ceramic
substrate, comprising the steps of:
(a) placing said ceramic substrate containing
said receiving metal in a chamber containing at least
one source metal, and wherein at least a portion of at
least one inert material is in floating contact with
at least a portion of said at least one receiving
metal,
(b) heating said chamber and its contents in a
non-oxidizing environment at a temperature in the
range from between about 700°C to about 1,000°C, for a
period of time ranging to a maximum of about 200
minutes,
(c) allowing said chamber and its contents to
cool so that said receiving metal has at least one
layer of said source metal adhered thereto, and
(d) removing said ceramic substrate containing
said adhered layer of source metal to said receiving
metal, from said chamber.
3. The process of Claim 1, wherein said at least
one source metal is nickel or an alloy thereof.
4. The process of Claim 3, wherein said nickel
alloy is selected from the group consisting of nickel-
copper and nickel-cobalt.
9. The process of Claim 1, wherein a thickness
of said layer of source metal over said receiving
metal is between about 0.01 micron to about 15
microns, and preferably between about 3 microns to
about 10 microns.
15. The process of Claim 1, wherein said heating
of said chamber and its contents are done in a
furnace.
The examiner relies on the following prior art references
as evidence of unpatentability:
Park 4,590,095 May 20, 1986
(Park ‘095)
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