Appeal No. 2001-2200
Application No. 09/286,328
BACKGROUND
The invention is directed to a surface acoustic wave device, and a process for
producing the device. Representative claims 1, 8, and 34 are reproduced below.1
1. A surface acoustic wave device comprising:
a piezoelectric substrate; and
an electrode formed on said substrate [by alternately laminating] of an
aluminum copper alloy film and a copper film [such that said electrode has a
three-layered laminate structure with two aluminum-copper alloy films
sandwiching one copper film] with CuAl2 formed at an interface between said
aluminum-copper alloy film and said copper film.
8. A surface acoustic wave device comprising:
a piezoelectric substrate; and
an electrode formed on said substrate, the electrode having aluminum-
copper alloy films and a CuAl2 layer formed between the aluminum- copper alloy
films.
34. A surface acoustic wave device comprising:
a piezoelectric substrate; and
an electrode formed on said substrate by a process comprising the steps
of :
laminating an aluminum-copper alloy film and a copper film thereby
forming a laminated structure; and
heating the laminated structure.
1 We note that appellants’ amendment filed Jun. 12, 2000 complies with neither the current nor
earlier version of 37 CFR § 1.173. See Manual of Patent Examining Procedure § 1453, “Amendments to
Reissue Applications” (Eighth Ed. Aug. 2001).
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