Appeal No. 2001-1305
Application 08/872,782
an organic carrier (card platform) mounting an I/C chip and
mounted on a substrate according to the present invention. See
page 6 of the Appellants’ specification. Figure 1 shows
dielectric layers 6 and 7, as well as dielectric layers 2 and 3.
These dielectric layers are composite materials having a
uoropolymer matrix, such as a PTFE matrix, containing, as a
filler ingredient, ceramic particulate filler, such as silica
(e.g., amorphous fused silica powder). See pages 7 and 8 of the
Appellants’ specification. Appellants recognize that the problem
with these ceramic filler layers is that they allow corrosion
when exposed to process chemicals such as resist strippers. See
page 8 of Appellants’ specification. Appellants solve this
problem by providing PTFE layers 8 and 9. The PTFE barrier
layers 8 and 9 are free of ceramic components and additives, such
as silica or glass, and like materials which are not chemically
inert to the presence of standard processing chemicals used to
lipographically define fine line circuitry, electrical
interconnection pads, and the like. The fluoropolymer barrier
layers 8 and 9 consist essentially of fluoropolymer, i.e., while
it is preferred to use a 100% pure fluoropolymer material in
barrier layers 8 and 9, the presence of merely trace amounts of
impurities of ceramics in layers 8 and 9 is also within the scope
2
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 Next
Last modified: November 3, 2007