Appeal No. 2001-1305
Application 08/872,782
ceramic-containing dielectric layer . . . at least one outermost
protective impermeable fluorpolymer barrier layer devoid of
ceramic material disposed on and covering said at least one
ceramic containing dielectric layer, said outermost protective
impermeable fluoropolymer barrier layer being impermeable to
process chemicals encountered during fabrication of said
integrated circuit chip and permitting metallized ceramic line
processing without degradation of said integrated circuit chip”
as set forth in Appellants’ claim 1. Furthermore, we failed to
find that Bindra teaches or suggests,
a laminate having opposite outer surfaces and including at
least one ceramic containing dielectric layer disposed and
covering one of said opposite outer surfaces, said surfaces
further comprising fine line circuitry and at least one
outer most impermeable protective fluoropolymer barrier
layer devoid of ceramic material wherein said outer most
impermeable barrier layer covers said at least one ceramic-
containing dielectric layer and is impermeable to process
chemicals encountered during fabrication of said circuitized
structure and permits metallized ceramic line processes
without degradation of said circuitized structure;
as recited in Appellants’ claim 10.
Therefore, we will not sustain the Examiner’s rejection of
claims 1 through 4 and 10 through 12 under 35 U.S.C. § 103 as
being unpatentable over Bindra in view of Kametani.
We now turn to the rejection of claims 5 through 9 and 17
under 35 U.S.C. § 103 as being unpatentable over Bindra in view
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