Appeal No. 2001-1305
Application 08/872,782
Upon our view of Bindra, we find that Bindra teaches in the
background of the invention that the prior art high density
circuit boards use a dielectric constant (Er) of about 3.2 or
less, in order to reduce signal propagation delays and reduce
signal noise and attenuation. See column 1, lines 37 through
50. Bindra further discloses that the prior art suitable
materials which can be used to provide an Er of 3.2 or below.
These suitable materials are fluorocarbons such as, for example,
polytetrafluoroethylene (PTFE), polychlorotrifluoroethylene
(CTFE), and polyperfluoropropylene, optionally filled with a
filler, such as certain kinds of quartz or silicon particles.
See column 2, lines 13 through 18. Bindra is concerned with the
method or structure, wherein a dielectric material encapsulizes
each high density wire core, and wherein encapsulated high
density cores are aligned, using the joining material for
alignment, to test on the subcomposite level and build for a high
density printed circuit board or card. See column 3, lines 34
through 42.
Bindra discloses that figure 1 shows the best mode for
carrying out the invention. In particular, figure 1A shows an
encapsulated circuitized power core ready for joining to a like
core. A dielectric material 1 is disposed on top the CPC, except
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