Appeal No. 2001-1305
Application 08/872,782
of the invention, as long as the trace amounts of ceramic are not
present in the amounts sufficient to sustain attack by process
chemicals extensively enough to permit penetration of the process
chemicals through the thickness of the barrier layer. See pages
8 and 9 of the Appellants’ specification.
Independent claim 1 present in the application is reproduced
as follows:
1. A packaging platform useful for interconnecting
integrated circuit chips and cards, in which the platform
comprises:
a circuitized laminate having opposite outer surfaces;
at least one ceramic-containing dielectric layer disposed on
at least one of the opposite outer surfaces of said circuitized
laminate.
at least one outermost protective impermeable fluoropolymer
barrier layer devoid of ceramic material disposed on and covering
said at least one ceramic containing dielectric layer, said
outermost protective impermeable fluoropolymer barrier layer
being impermeable to process chemicals encountered during
fabrication of said integrated circuit chip and permitting
metallized ceramic line processes without degradation of said
integrated circuit chip;
at least one through hole extending between opposite outer
surfaces of said laminate; and
a conductive material coating said at least one through
hole.
3
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