Ex Parte GEDNEY et al - Page 3



              Appeal 2006-1454                                                                                         
              Application 09/004,524                                                                                   
              Patent 5,483,421                                                                                         

                    6. Appellants filed:                                                                               
                    (1) an Appeal Brief (the Brief) on August 16, 2000;                                                
                    (2) a Reply Brief (the reply) on November 20, 2000; and                                            
                    (3) a Supplemental Reply Brief (“the second reply”) on February 18, 2005.                          
                    7. The sole issue before the Board is whether Appellants have                                      
              established that the Examiner erred in rejecting claims 21-25, and 34 under                              
              35 U.S.C. § 251 based on recapture.                                                                      


                                            II.  FINDINGS OF FACT                                                      
                    The following findings of fact are believed to be supported by a                                   
              preponderance of the evidence.                                                                           

                                                 A.  The Invention                                                     
                    1. This invention relates generally to the attachment of integrated circuit                        
              devices to printed circuit cards, and more particularly to the attachment of                             
              integrated circuit (IC) semi-conductor chips to printed circuit cards utilizing a chip                   
              carrier which has a coefficient of thermal expansion (TCE) that matches the                              




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