There may be successive bond issues for the purpose of financing the same industrial projects, including land, buildings, or facilities, involving one (1) or more industries, and there may be successive bond issues for financing the cost of reconstructing, replacing, constructing additions to, extending, improving, and equipping industrial projects, including land, buildings, or facilities, already in existence, whether or not originally financed by bonds issued under this subchapter, with each successive issue to be authorized as provided by this subchapter.
Section: Previous 14-164-208 14-164-209 14-164-210 14-164-211 14-164-212 14-164-213 14-164-214 14-164-215 14-164-216 14-164-217 14-164-218 14-164-219 14-164-220 14-164-221 14-164-222 NextLast modified: November 15, 2016