Ex parte TSUKAGOSHI et al. - Page 5


                 Appeal No. 94-3121                                                                                                                    
                 Application 07/853,868                                                                                                                

                 “desired” encapsulation of the curing agent of those compositions as suggested by the general                                         
                 teaching of Bentov et al.  Indeed, the curing of the phenoxy based “structural” resin adhesive                                        
                 compositions under the pressure and temperature conditions recited in Fujiwara et al. would not                                       
                 have suggested a “desire” to one of ordinary skill in this art to encapsulate the curing agent in                                     
                 order to control the curing reaction in forming a laminated circuit board.  The teachings of                                          
                 Fujiwara would further not have reasonably suggested to one of ordinary skill in this art that such                                   
                 an adhesive composition would have been suitable for use in place of the simpler epoxy resin                                          
                 adhesive compositions of Hatada and Schmidt et al. which do not contain a further resin or a                                          
                 curing agent and are used under different pressure and curing conditions in a different manner for                                    
                 a different purpose.  The examiner has not brought forward any evidence of other knowledge in                                         
                 this art area or set forth any scientific reasoning which would at least prima facie establish why                                    
                 one of ordinary skill in the art would have been motivated to modify the teachings of Hatada and                                      
                 Schmidt et al. to arrive at appellants’ invention.  Indeed, mere “agreement” between disclosures in                                   
                 appellants’ specification and disclosures found in the prior art does not accomplish this purpose.                                    
                 See, e.g., Warner, supra.  Furthermore, even if the adhesive composition of Fujiwara  et al. were                                     
                 modified by encapsulating the curing agent thereof, the use of such compositions in the processes                                     
                 of Hatada and Schmidt et al. would not have resulted in the claimed processes since there is no                                       
                 teaching or suggestion in these references to use the adhesive compositions thereof under the                                         
                 conditions of temperature and pressure necessary to achieve the cure rate as specified in the                                         
                 appealed claims.  See, e.g. Uniroyal Inc. v. Rudkin-Wiley Corp., 837 F.2d 1044, 1050-53, 5                                            
                 USPQ2d 1434, 1438-40 (Fed. Cir. 1988).  Accordingly, the record before us supports the                                                
                 inference that the examiner has relied on information gleaned from appellants’ disclosure in                                          
                 formulating the grounds of rejection on appeal.  Dow Chemical, supra; Warner, supra.                                                  






                          The examiner’s decision is reversed.                                                                                         
                                                                      Reversed                                                                         


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