Appeal No. 94-4489
Application No. 07/857,216
The Gaworowski patent discloses a two-stage
curing cycle in which the compressible elastomeric
layer is cured in a first operation, thus fixing the
microcapsules in set positions within the layer,
followed by a second curing stage to form the
laminate structure.
The Gaworowski patent also states (column 4, lines 50-64)
that:
[C]onventional resinous microcapsules that are known
in the art may be used in the intermediate layer.
Any microcapsules having the properties described
herein will be suitable for use in the present
invention. Microcapsules having a melting point of
about 165°F. to 270°F can be used. Preferably, the
microcapsules will melt at about 180°F. Some of the
materials suitable for use in the microcapsules are
phenolic resin, and thermoplastic materials such as
polyvinylidene chloride. Preferably, the materials
used in making the microcapsules will be
thermoplastics. Examples of such materials are
vinylidene chloride, methacrylate, polyvinyl
chloride, acrylonitrile, and copolymers thereof.
Preferably, a copolymer of acrylonitrile and
vinylidene chloride will be used.
Although a vulcanization temperature of 110° to 170EF is
specifically mentioned, the Gaworowski reference indicates
that any “sufficient heat” can be used to vulcanize (cure) the
layer. See column 5, lines 55-63. Sufficient heat embraces
any temperature below the melting point temperature of the
microcapsules. See column 8, lines 3-8. In other words, when
the Gaworowski reference employs microcapsules having a
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