Appeal No. 95-2320
Application No. 08/074,517
This is a decision on appeal from the final rejection of
claims 7 through 11, the only claims pending in the application.2
The invention is directed to a method of manufacturing a
semiconductor device which has specific circuits and redundant
circuits as well as connections which can be fused and removed
for replacing a defective circuit with a redundant circuit.
Independent claim 7, illustrative of the invention, is
reproduced as follows:
7. A manufacturing method of a semiconductor device which
includes at least a specific circuit portion and a spare
redundant circuit portion having the same function as said
specific circuit portion as well as a connection which can be
fused and removed for replacing a defective specific circuit
portion with said redundant circuit portion, said method
comprising the steps of:
forming interconnection layers and a testing electrode on an
insulator layer formed on a main surface of a semiconductor
substrate, said interconnection layers being spaced from each
other and located at opposite sides of a region of a connection
conductive layer embedded in and completely covered by said
insulator layer, and a testing electrode being spaced from said
interconnection layers;
forming a concave portion which is located in said insulator
layer between said interconnection layers and has a final bottom
wall, formed of said insulator layer, located immediately above
said connection conductive layer; and
2We note that appellants make reference, throughout the
brief to “claim 1.” Since there is no claim 1, appellants are
apparently referring to “claim 7” and we construe this to be the
case.
2
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