Appeal No. 96-0515
Application 08/169,081
substrate containing a plurality of ink channel plates (col.
2, lines 28-32). Figure 1 shows a filter 14 and a silicon
wafer 16 having a plurality of channel plates 31 formed
therein (col. 3, lines 51-54; col. 4, lines 41-44). Referring
to Figure 2, each channel plate 31 has an ink fill hole 25
(col. 3, lines 56-60). As shown in Figure 7, the pores 24 of
filter 14 are much smaller than the fill holes 25 in each
channel plate 31. Filter 14 is adhered to wafer 16 as follows
(col. 4, lines 45-68):
Basically, the method of bonding the filter 14 to the
channel wafer 16 is accomplished by coating a flexible
substrate (not shown) with a relatively thin uniform
layer of adhesive having an intermediate non-tacky curing
stage with a shelf life of around one month for ease of
alignment of parts and ease of storage of the components
having the adhesive thereon. About half of the adhesive
layer on the flexible substrate is transferred to the
surface of [sic] 33 of the wafer within a predetermined
time of the coating of the flexible substrate by placing
it in contact therewith and applying a predetermined
temperature and pressure to the flexible substrate prior
to peeling it from the channel wafer. This causes the
adhesive to fail cohesively in the liquid state, assuring
that about half of the thickness of the adhesive layer
stays with the flexible substrate and is discarded
therewith, leaving a very thin uniform layer of adhesive
on the channel wafer surface 33 without permitting the
adhesive to flow into the fill hole edges. The
transferred adhesive layer remaining on the wafer surface
enters in[to] an intermediate, non-tacky curing stage to
assist in subsequent alignment of the filter. The filter
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Last modified: November 3, 2007