Ex parte ONG et al. - Page 15




               Appeal No.      96-0359                                                                                               
               Serial No.      08/083,866                                                                                            

                       First, Table 3 on page 389 in Kirk-Othmer indicates that LLDPE fluid bed gas phase                            
               manufacturing processes can yield LLDPE with densities from 0.918-0.94 g/cm .  Thus, it is not clear3                                  

               that a polyethylene blend density with a lower limit of "about 0.940" necessarily excludes the                        

               polyethylene blends of Lee, especially since, as noted by the examiner, the individual density of each                

               component HMW and LMW polymer may be as high as 0.965 g/cc. which overlaps with the claimed                           

               density values (in Lee see column 2, lines 38-40; Answer page 15).  Second, we agree with the                         

               examiner that the claimed blend MFR overlaps with Lee's disclosure since each polymer component of                    

               Lee may individually have an MFR of about 20 to about 70 (column 2, especially lines 40-41) and the                   

               term "about" allows some latitude (Answer page 9).  Third, Lee also appears to be concerned with the                  

               production of LLDPE resins suitable for film production (e.g., " [t]he bulk of LLDPE is used in film                  

               production" (column 1, lines 37-38) and the discussion of film production methods in the paragraph                    

               bridging columns 1-2).  Further, skill is presumed on the part of the artisan, rather than the lack thereof.          

               In re Sovish, supra.  Fourth, as indicated supra, a U.S. patent (e.g., Lee) and its disclosure are                    

               presumed valid (35 U.S.C. § 282), and this presumption of validity applies to the patent's disclosure as              

               well as to each of its claims.  In re Spence, supra.  After reviewing all the evidence of record on the               

               issue of enablement of the Lee patent, it is our judgment that appellants have not provided sufficient                

               evidence to establish that Lee is a non-enabling disclosure with respect to the production of HMW and                 

               LMW components and blends as described.  Finally, when a claimed product and a prior art product                      

               reasonably appear to be substantially the same based on a similarity of reactants, reaction conditions                

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