Appeal No. 96-0380
Application No. 08/229,857
that Figure 1 illustrates a standard type of lead frame 10
including a first plurality of conductive fingers 11 and a
paddle
13. A gap 15 is formed between the first plurality of
conductive fingers 11 and the paddle 13. Appellants disclose
in column 3 of the specification that in order to provide for
the high density interconnection, an additional element is
provided to bridge the gap between the lead frame and the
paddle. Appellants further disclose that Figure 2 illustrates
the additional element, a third plurality of conductive
fingers 16, connecting to the ends of the first plurality of
conductive fingers 11. The third plurality of conductive
fingers 15 partially bridges the gap between the first
plurality of conductive fingers 11 and the paddle 13.
The independent claim 1 is reproduced as follows:
1. A semiconductor device package comprising:
a mounting pad;
a plurality of first conductive
lead
frame fingers with one end of each in close lateral
proximity to the pad and defining a first gap
therebetween; and
a plurality of second conductive
fingers
formed on an insulating tape layer and extending
over the first gap, one end of said second
conductive
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