Appeal No. 96-1508
Application No. 08/112,445
This is a decision on appeal from the final rejection of
claims 27 through 50, all of the claims pending in the
application.
The invention is directed to a guard wall for reducing
delamination effects in a semiconductor die.
Representative independent claim 27 is reproduced as
follows:
27. A semiconductor die comprising:
a semiconductor substrate;
an electrically active region on the substrate;
a patterned dielectric layer over the substrate and the
electrically active region; and
a guard wall extending through the dielectric layer, the
guard wall lying adjacent to the electrically active region,
the guard wall disposed in a guard wall opening in the
dielectric layer, the guard wall opening having a main section
and a plurality of cross sections, the guard wall including at
least one sidewall spacer along the main section of the guard
wall opening and a filling material.
The examiner relies on the following references:
Yasunari 4,317,274 Mar. 2,
1982
Kosonocky 4,375,597 Mar.
1, 1983
Lee 4,641,420 Feb. 10,
1987
2
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