Appeal No. 1996-2088
Application No. 08/082,432
DECISION ON APPEAL
This is a decision on appeal under 35 U.S.C. § 134 from the decision of the examiner finally
rejecting claims 16 through 22 and 24 and refusing to allow claim 23 as amended subsequent to the
final rejection, which are all of the claims pending in this application.2
Claims 16, 19 and 22 are illustrative:
16. A metallization method comprising the steps of:
forming a contact hole in an insulating film on a substrate;
forming a barrier metal layer on at least a bottom and a sidewall of the contact
hole, said barrier metal layer comprising a composite titanium/titanium
oxynitride/titanium layer; and then
depositing a layer of aluminum-based material directly on the uppermost
titanium layer in the contact hole while heating the substrate at a temperature of 450EC
to 550EC to fill the contact hole.
19. A metallization method comprising the steps of:
forming at least one contact hole in an insulating film on a substrate;
forming a barrier metal layer on at least a bottom and a sidewall of the contact
hole, said barrier metal comprising a composite titanium/titanium oxynitride/titanium
layer;
depositing a first layer of aluminum-based material directly on the uppermost
titanium layer of the barrier metal layer without heating the substrate, said first layer
having a thickness less than enough to completely fill the contact hole; and then
depositing a second layer of aluminum-based material in the contact hole while
heating the substrate at a temperature of 450EC to 550EC to completely fill the contact
hole.
2The amendment filed April 19, 1995 (Paper No. 16), amending claim 23, was entered by the examiner in the
advisory action mailed May 8, 1995 (Paper No. 17).
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