Appeal No. 1996-2094
Application No. 08/302,085
This is an appeal under 35 U.S.C. § 134 from the
examiner’s refusal to allow claims 1 through 4 which are all
the claims remaining in the application. Claims 5 through 7
were canceled in an amendment received March 30, 1993.
THE INVENTION
The invention is directed to a multilayer thin film
circuit substrate in which a conductor layer forming at least
one signal transmission path, each having an upper surface and
a periphery, is substantially surrounded by a first insulator
layer covering substantially all of the upper surface and the
periphery of each signal transmission path. The first
insulator layer is surrounded by a second insulator layer. The
dielectric constant of the second insulator layer is larger
than the dielectric constant of the first insulator layer.
Furthermore, the second insulator layer has more adhesiveness
than the first insulator layer.
THE CLAIM
Claim 1 is illustrative of appellants’ invention and is
reproduced below.
1. A multilayer conductor thin film circuit substrate,
comprising:
2
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