Appeal No. 96-2103
Application 08/194,515
Claims 11 and 21 are illustrative of the subject matter on appeal and read as
follows:
11. A thermally stable, weather-resistant polyamide molding composition based on
aliphatic or aromatic polyamides, produced by polymerization in the presence of 10 to
5000 ppm, based on composition, of an ionic or complexed copper stabilizer selected
from the group consisting of CuBr, CuI, CuCl, Cu carbonate, Cu hydroxycarbonate, CuCN,
Cu naphthenate, and copper complexes based on amines, phosphines, phenols or
cyanides, which composition contains finely-divided, elemental copper in colloidal form
produced in situ from said copper stabilizer by the addition, before or during said
polymerization, of 10 to 5000 ppm, based on composition, of a reducing agent selected
from the group consisting of hypophosphite salts and salts of dithionic acids.
21. A method of preparing a stable, weather-resistant polyamide molding
composition, which comprises polymerizing the polyamide in the presence of 10 to 5000
ppm, based on composition, of an ionic or complexed copper stabilizer selected from the
group consisting of CuBr, CuI, CuCl, Cu carbonate, Cu hydroxycarbonate, CuCN, Cu
naphthenate, and copper complexes based on amines, phosphines, phenols or cyanides,
and in the presence of 10 to 5000 ppm, based on composition, of a strong reducing agent
selected from the group consisting of hypophosphite salts and salts of dithionic acid,
whereby the reduction of the copper compound forms colloidal copper in situ in the
polyamide.
The references relied on by the examiner are:
Stamatoff 2,705,227 Mar. 29, 1955
Watanabe et al. (Watanabe) 3,280,052 Oct. 18, 1966
Kelmchuk 3,691,131 Sep. 12, 1972
Plischke et al. (Plischke) 5,851,466 July 25, 1989
Hackh's Chemical Dictionary, Fourth Edition, pages 222-23 (1969).
2
Page: Previous 1 2 3 4 5 6 7 8 Next
Last modified: November 3, 2007