Appeal No. 1996-3534
Application 08/323,410
forming insulating fillets along the perimeter regions of the seed layer between the seed layer
and an underlying layer for preventing electroplating of material adjacent the perimeter regions on the
seed layer.
7. In a process for selective metal deposition using laser writing to form activated seed layers
for electroplating of a conductive metal thereon, the improvement comprising:
preventing conductor shorting due to the electroplating by providing means for protecting
metallic material located adjacent the activated seed layer from being electroplated.
8. The improvement of Claim 7, wherein the means is provided by forming electrically
insulating fillets along edge crevices of the activated seed layer for insulating any exposed conductive
material adjacent the perimeter regions of the activated seed layer.
15. An integrated circuit component including a substrate, at least one integrated circuit chip
and at least one metallic interconnect formed by electroplating conductive material on an activated seed
layer, including means for protecting conductive material located adjacent a perimeter of the activated
seed layer from shorting due to electroplating of the conductive metallic interconnect.
16. The integrated circuit component of Claim 15, wherein said means comprises at least one
fillet of insulating material.
According to appellants, appealed claims 1 through 14 encompass processes wherein the
process of preparing a seed layer for selective metal deposition taught in Bernhardt is improved upon
by “providing sufficient insulation between the activated seed layer and the underneath perimeter region
of the components on which the seed later is formed to prevent shorting of the conductor lines via the
perimeter regions during subsequent electroplating” (specification, page 3, lines 3-18). Claims 15
through 17 encompass an integrated circuit component that includes at least one metallic interconnect
formed by electroplating conductive material on an activated seed layer, and means for protecting
conductive material located adjacent a perimeter of the activated seed layer from shorting due to
electroplating, which means can comprise at least one fillet of insulting material.
The references relied on by the examiner are:
Ipri et al. (Ipri) 4,965,646 Oct. 23, 1990
Bernhardt 5,098,526 Mar. 24, 1992
The examiner has rejected appealed claims 1 through 6 under 35 U.S.C. § 102(b) as
anticipated by or, in the alternative, under 35 U.S.C. § 103 as obvious over Ipri. The examiner has
also rejected appealed claims 7 and 15 through 17 under 35 U.S.C. § 102(b) as anticipated by or, in
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