Ex parte BONNEAU et al. - Page 2




          Appeal No. 1996-3669                                                        
          Application No. 08/274,132                                                  


          the application.  Claims 1-12, 17, 25, and 30-34 have been                  
          canceled.                                                                   
               The claimed invention relates to a method of                           
          manufacturing integrated circuits using an architecture having              
          multiple processors and multiple memories.  More particularly,              
          Appellants indicate at page 4 of the specification that the                 
          modular characteristic of the architecture enables the                      
          integrated circuit to have a majority of the same address and               
          data pin-outs regardless of the number of processors on the                 
          chip.                                                                       
               Claim 13 is illustrative of the invention and reads as                 
          follows:                                                                    
               13.  A method of manufacturing integrated circuits using               
          semiconductor chips, comprising the steps of:                               
               a.        making an architecture having multiple instances             
          of a                modular unit including a processor, a                   
          memory and a             crossbar link disposed therebetween,               
          said crossbar            links of said modular units connected              
          together                 providing direct communication                     
                                   between any processor and any                      
                                   memory of a predetermined number                   
                                   of said multiple modular units,                    
                                   and having input/output pads for                   
                                   connecting said architecture to                    
                                   external circuits;                                 



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