Appeal No. 96-4083
Application 08/268,039
reasonably expected to use the solution that is claimed by the
Appellants. We agree with the Examiner that it was well
known in the art to package integrated circuits. Furthermore,
we find that it was well known in the art that packaging was
done for the purposes of providing protection and allowing
simplicity of attachment. Therefore, we find that it would
have been obvious to those skilled in the art to package the
circuit shown in Figure 1 of Fenner. Therefore, we will
sustain the Examiner's rejection of claim 5 under 35 U.S.C. §
103.
Claims 15 through 20 and 45 through 47 stand
rejected under 35 U.S.C. § 103 as being unpatentable over
Fenner and Suzuki. On page 11 of the brief, Appellants argue
that neither of the cited references teaches, mentions or
suggests the bypass capacitor connected between an electrode
of the semiconductor laser diode and a common connection means
as recited in claim 15. As shown above, Fenner does teach
a bypass capacitor connected between an electrode of the
semiconductor diode and the common connection means.
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