Ex parte PENN et al. - Page 8




          Appeal No. 1997-1380                                                        
          Application 08/301,508                                                      


          Pomerantz discloses a CAD-controlled system for the layer-by-               
          layer production of a three-dimensional physical model made of              
          radiation polymerizable resin.  The system 500, which is                    
          illustrated schematically in Figure 22, includes a mask                     
          producing subsystem 502 and a physical model producing                      
          subsystem 504.  Subsystem 502 produces mask-bearing substrates              
          514 corresponding to respective layers of the physical model.               
          As described by Pomerantz,                                                  
                    [i]n the physical model producing subsystem 504,                  
               the mask bearing substrate is precisely positioned                     
               in operative engagement with an exposure unit 530 .                    
               . .  .                                                                 
                   The three dimensional model is built up layer by                  
               layer on a model support surface 534 which can be                      
               selectably positioned along the X and Z axes by suitable               
               conventional positioning apparatus 536.  Initially the                 
               model support surface 534 is located in operative                      
               engagement with and under a resin applicator 540 . . .  .              
                                                                                     
                    Applicator 540 . . . is operative to provide a                    
               layer 550 of resin onto support surface 534 which                      
               layer is of generally uniform thickness, typically                     
               0.15 mm.  Following application of a resin layer                       
               thereto, the surface 534 is positioned in operative                    
               engagement with, and under exposure unit 530, such                     
               that the mask [515] formed on substrate 514 lies                       
               intermediate the light source and the layer 550 in                     
               proximity to layer 550     . . . permitting exposure                   
               of the layer 550 through the mask 515 and consequent                   
               hardening of the exposed regions of the layer 550.                     
               . . .                                                                  

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