Appeal No. 1997-1885
Application No. 08/296,671
This is a decision on the appeal under 35 U.S.C. § 134
from the examiner’s rejection of claims 1-12, 14, 23 and 24,
which constitute all the claims remaining in the application.
Four amendments after final rejection were filed in this
application. The amendments designated “B” and “D” were not
entered by the examiner whereas the amendments designated “C”
and “E” have been entered by the examiner.
The disclosed invention pertains to a semiconductor
device package.
Representative claim 1 is reproduced as follows:
1. A semiconductor device package, comprising:
(a) a metal base having a top surface and a cavity
formed in the top surface;
(b) a lead frame having a plurality of leads, the
lead frame being supported by the top surface of the base;
(c) an insulating layer positioned between the
lead frame and the top surface of the base, the insulating
layer being arranged to electrically insulate the lead frame
from the base;
(d) an integrated circuit die received within the
base
cavity and electrically coupled to the lead frame;
(e) a plastic cap molded over the top surface of the
metal base, the die and an inner portion of lead frame, the
cap cooperating with the base to encapsulate the die wherein
the plastic cap is in direct contact with the integrated
circuit die.
-2-
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Next
Last modified: November 3, 2007