Ex parte MATSUURA et al. - Page 5




          Appeal No. 1997-2628                                       Page 5           
          Application No. 08/383,713                                                  


               The examiner (answer, page 5) further opines that:                     
               [t]he basis for the combination is that Higaki                         
               clearly shows that microwave component can be formed                   
               by using Tl-Ba-Ca-Cu-O compounds as superconductor                     
               materials and heat treatment of the deposited thin                     
               film would enhance thin film uniformity and                            
               characteristics.                                                       

               The difficulty we have with the examiner’s stated                      
          position stems from the fact that Higaki’s teachings are                    
          directed to a method of forming a single thin film at the                   
          {110} plane of a single crystal of magnesium oxide, not a                   
          process for forming thin films on opposite planar surfaces of               
          a dielectric substrate in a manner to produce essentially                   
          uniform superconductive characteristics for both films.  (See               
          Higaki at column 2,                                                         
          lines 66 through column 3, line 9 and the examples).                        
          Moreover, the examiner has not specifically pointed out where               
          either of the alternative secondary references relied upon by               
          the examiner teaches or suggests a method, as claimed herein,               
          for forming such films of substantially uniform                             
          superconductive characteristics on opposite sides of a                      
          dielectric substrate.                                                       









Page:  Previous  1  2  3  4  5  6  7  8  9  10  11  Next 

Last modified: November 3, 2007