Appeal No. 1997-3155
Application No. 08/424,828
die paddle that supports a die and a support means. Each bond
wire in the
assembly extends continuously as one wire from the die to a
corresponding lead finger. The intermediate portion of each
continuous bond wire is affixed to the support means.
Claim 1 is illustrative of the claimed invention, and it
reads as follows:
1. Composite lead frame, comprising:
a lead frame having a plurality of lead fingers radiating
from a central area, and a die paddle located in the central
area; and
support means disposed on the die paddle, for supporting
intermediate portions of bond wires extending from a die on
the die paddle to the lead fingers, each bond wire extending
continuously as one wire from the die to a corresponding lead
finger, wherein an electrical connection is established from
the die to said corresponding lead finger based exclusively on
said one wire, each intermediate portion being affixed to the
support means.
The reference relied on by the examiner is:
Aoki et al. (Aoki) 4,903,114 Feb.
20, 1990
Claims 1 through 12 and 18 through 28 stand rejected
under 35 U.S.C. § 103 as being unpatentable over Aoki.
2
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