Appeal No. 1997-3727
Application 08/416,127
attached by an adhesive to a flexible substrate. Typically,
these are semiconductor chips which may include linear arrays
of photosensors, or alternately, portions of ink-jet ejectors.
The invention provides a method of removing a selected chip
from the substrate with minimum risk of damage to the
neighboring chips.
The invention is further illustrated by the following claim.
1. A method of removing a chip from a chip array having
a plurality of chips, each chip being attached by an adhesive
to a flexible substrate, comprising the step of:
causing the substrate to assume a convex bow;
causing the adhesive attaching the chip to the substrate
to release the chip by applying a lateral force, in a
direction substantially parallel to a main surface of the
substrate, to the chip.
The Examiner relies on the following references:
Japanese Patent Applications
Sugimoto 56-050,530 May 7,
1981
Suda 04-317,355 Nov. 9,
1992
Claim 1 stands rejected under 35 U.S.C. § 102 over
Sugimoto. Claims 3 to 5 stand rejected under 35 U.S.C. § 103
2
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