Ex parte QUINN et al. - Page 2

          Appeal No. 1997-3727                                                        
          Application 08/416,127                                                      

          attached by an adhesive to a flexible substrate.  Typically,                
          these are semiconductor chips which may include linear arrays               
          of photosensors, or alternately, portions of ink-jet ejectors.              
          The invention provides a method of removing a selected chip                 
          from the substrate with minimum risk of damage to the                       
          neighboring chips.                                                          
          The invention is further illustrated by the following claim.                

               1.  A method of removing a chip from a chip array having               
          a plurality of chips, each chip being attached by an adhesive               
          to a flexible substrate, comprising the step of:                            
               causing the substrate to assume a convex bow;                          
               causing the adhesive attaching the chip to the substrate               
          to release the chip by applying a lateral force, in a                       
          direction substantially parallel to a main surface of the                   
          substrate, to the chip.                                                     
          The Examiner relies on the following references:                            
          Japanese Patent Applications                                                
          Sugimoto                      56-050,530               May  7,              
          Suda                          04-317,355               Nov. 9,              
          Claim 1 stands rejected under 35 U.S.C.  102 over                          
          Sugimoto.  Claims 3 to 5 stand rejected under 35 U.S.C.  103               


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