Ex parte WONG - Page 13

          Appeal No. 1998-0338                                                        
          Application No. 08/350,865                                                  

          and who had before him in his workshop the prior art, would                 
          have been reasonably expected to use the solution that is                   
          claimed by the Appellants.                                                  
               We find that those skilled in the art having the                       
          teachings of APA and Nishimoto before them would not have put               
          slits in the lower metal plate.                                             
               First, Appellant claims to have discovered the problem.                
          The Examiner has not contested this, nor shown cracking in a                
          bonding pad to be a known problem in the prior art.                         
               Second, even if bonding pad cracks were known in the                   
          prior art, we see no motivation to apply Nishimoto’s                        
          passivation layer cracking solution to bonding pads.                        
          Nishimoto’s solution is to reduce the effective width of the                
          underlying wiring bus.  We are not convinced that one of                    
          ordinary skill in the art, seeing Nishimoto, would decide to                
          reduce the effective width of the lower metal plate in the                  
          bonding pad of APA.                                                         
               Third, Nishimoto’s bonding pad does not have slits, and                
          this may well be because the pad has no passivation layer to                
          crack.  On the other hand, APA has a passivation layer, but                 
          the cracking problem does not appear in this layer.                         

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