Appeal No. 1998-0372
Application No. 08/533,585
BACKGROUND
The disclosed invention pertains to the attachment of a heat sink and a lead frame
for use in packaged semiconductor devices. Claim 28 is reproduced below.
28. A device, comprising:
a heat spreader having a first main surface, a second main surface, corners
and spacing pads encompassing said corners; and
a lead frame having a void therein and lead fingers and support leads
extending from a periphery of said lead frame toward said void, said support leads
being attached to said spacing pads.
The examiner relies on the following references:
Dennis 4,766,478 Aug. 23, 1988
Asada et al. (Asada) 5,091,341 Feb. 25, 1992
Japanese Laid-Open Patent Application 2-129951, May 18, 1990 (Okada)2
Claims 26-28 stand rejected under 35 U.S.C. § 103 as being unpatentable over
Asada.
Claims 21 and 23-25 stand rejected under 35 U.S.C. § 103 as being unpatentable
over Asada, Okada, and Dennis.
The USPTO translation branch has provided an English translation (dated April, 2000) of the2
Japanese document. A copy of the translation is attached to this decision.
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