Appeal No. 1998-1095
Application No. 08/367,565
The disclosed invention relates to a soft metal
conductor. The soft metal in the soft metal conductor is
selected from the group consisting of Al, Cu and Ag.
Claim 1 is illustrative of the claimed invention, and it
reads as follows:
1. A soft metal conductor comprising an upper-most layer
consisting of grains capable of providing a substantially
scratch-free planar surface upon polishing in a subsequent
chemical mechanical polishing step, said soft metal is
selected from the group consisting of Al, Cu, Ag, binary and
ternary alloys of Al, Cu and Ag.
The reference relied on by the examiner is:
Kikkawa 5,345,108 Sept. 6,
1994
Claims 1 through 3, 5 through 14, 16 through 20, 39 and
40 stand rejected under 35 U.S.C. § 102(a) as being
anticipated by Kikkawa.
Reference is made to the final rejection, the brief and
the answer for the respective positions of the appellants and
the examiner.
OPINION
The 35 U.S.C. § 102(a) rejection of claims 1 through 3, 5
through 14, 16 through 20, 39 and 40 is reversed.
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